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 INTEGRATED CIRCUITS
PCK2000M CK97 (66/100MHz) Mobile System Clock Generator
Product specification 1998 Sep 29
Philips Semiconductors
Philips Semiconductors
Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
FEATURES
* Reduced pincount version of PCK2000 for mobile applications * Mixed 2.5V and 3.3V operation * Two CPU clocks at 2.5V * Six synchronous PCI clocks at 3.3V, one free-running * One 3.3V reference clock @ 14.318 MHz * Reference 14.31818 MHz Xtal oscillator input * 100 MHz or 66 MHz operation * Power management control input pins * 175 ps CPU clock jitter * 175 ps skew on outputs * Available in 28-pin SSOP package * 1.5 - 4ns CPU-PCI delay * Power down if PWRDWN is held LOW * See PCK2000 for 48-pin version
DESCRIPTION
The PCK2000M is a clock synthesizer/driver chip for a Pentium Pro or other similar processors, typically used in mobile applications. The PCK2000M has two CPU clock outputs at 2.5V. There are six PCI clock outputs running at 33 MHz. One of the PCI clock outputs is free-running. The 3.3V reference clock outputs at 14.318 MHz. All clock outputs meet Intel's drive strength, rise/fall time, jitter, accuracy, and skew requirements. The part possesses dedicated powerdown, CPUSTOP, and PCISTOP input pins for power management control. These inputs are synchronized on-chip and ensure glitch-free output transitions. When the CPUSTOP input is asserted, the CPU clock outputs are driven LOW. When the PCISTOP inputs is asserted, the PCI clock outputs are driven LOW. Finally, when the PWRDWN input pin is asserted, the internal reference oscillator and PLLs are shut down, and all outputs are driven LOW, except the free running PCICLK_F clock output. The PCK2000M is available in a 28-pin SSOP package.
PIN CONFIGURATION
XTAL IN XTAL OUT VSSPCI0 PCICLK_F PCICLK1 VDDPCI0 PCICLK2 PCICLK3 VDDPCI1 PCICLK4 1 2 3 4 5 28 27 26 25 24 VSSREF VDDREF REF VDDCPU CPUCLK0 CPUCLK1 VSSCPU VDDCORE1 VSSCORE1 PCISTOP CPUSTOP PWRDWN SEL SEL100/66
6 7 8 9 10
PCK2000M
TOP VIEW
23 22 21 20 19 18 17 16 15
PCICLK5 11 VSSPCI1 12 VDDCORE0 13 VSSCORE0 14
SA00448
ORDERING INFORMATION
PACKAGES 28-Pin Plastic SSOP TEMPERATURE RANGE 0C to +70C OUTSIDE NORTH AMERICA PCK2000M DB NORTH AMERICA PCK2000M DB DRAWING NUMBER SOT341-1
Intel and Pentium are registered trademarks of Intel Corporation.
1998 Sep 29
2
853-2128 20101
Philips Semiconductors
Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
PIN DESCRIPTION
PIN NUMBER 26 28 27 1 2 3, 12 4 6, 9 5, 7, 8, 10, 11 13, 21 14, 20 16 15 17 18 19 25 22 23, 24 SYMBOL REF VSSREF VDDREF XTAL_IN XTAL_OUT VSSPCI [0-1] PCICLK_F VDDPCI [0-1] PCICLK [1-5] VDDCORE [0-1] VSSCORE [0-1] SEL SEL100/66 PWRDWN CPUSTOP PCISTOP VDDCPU VSSCPU CPUCLK [0-1] 14.318 MHz clock output GROUND for REF output POWER for REF output 14.318 MHz crystal input 14.318 MHz crystal output GROUND for PCI outputs Free-running PCI output POWER for PCI outputs PCI clock outputs. Isolated POWER for core Isolated GROUND for core Logic select pins Select pin for enabling 66 MHz or 100MHz or 66 MHz. L = 66 Mhz H = 100MHz Control pin to put device in powerdown state, active low Control pin to disable CPU clocks, active low Control pin to disable PCI clocks, active low Power for CPU outputs GROUND for CPU outputs CPU and Host clock outputs 2.5V FUNCTION
NOTE: 1. VDD and VSS names in the above tables reflects a likely internal POWER and GROUND partition to reduce the effects of internal noise on the performance of the device. In reality, the platform will be configured with the VDDCPU pins tied to a 2.5V supply, all remaining VDD pins tied to a common 3.3V supply and all VSS pins being common.
BLOCK DIAGRAM
XTAL_IN X 14.318 MHZ OSC PWRDWN LOGIC X REFCLK (14.318 MHz)
XTAL_OUT X
PLL1
STOP LOGIC
X CPUCLK [0-1]
SEL0 X LOGIC SEL100/66 X
PWRDWN LOGIC
X PCICLK_F (33MHz)
STOP LOGIC CPUSTOP X PCISTOP X PWRDWN X
X PCICLK [1-5] (33MHz)
SW00275
1998 Sep 29
3
Philips Semiconductors
Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
SELECT FUNCTIONS
SEL100/66 0 0 1 1 SEL0 0 1 0 1 FUNCTION TRI-State Active 66MHz Test mode Active 100MHz 1 NOTES 1
NOTES: 1. Internal decode logic for all two select inputs implemented.
FUNCTION DESCRIPTION Tri-State Test mode
OUTPUTS CPU Hi-Z TCLK/2 PCI, PCI_F Hi-Z TCLK/6 REF Hi-Z TCLK
FUNCTION TABLE
SEL 100/66 0 1 CPU/PCI RATIO 2 3 CPUCLK (0-1) (MHz) 66.66 100 CPICLK (1-5) PCICLK_F (MHz) 33.33 33.33 REF (MHz) 14.318 14.318
CLOCK ENABLE CONFIGURATION
CPUSTOP X 0 0 1 1 PCISTOP X 0 1 0 1 PWRDWN 0 1 1 1 1 CPUCLK LOW LOW LOW 100/66MHz 100/66MHz PCICLK LOW LOW 33MHz LOW 33MHz PCICLK_F LOW 33MHz 33MHz 33MHz 33MHz OTHER CLOCKS Stopped Running Running Running Running PLL OFF Running Running Running Running OSCILLATOR OFF Running Running Running Running
POWER MANAGEMENT REQUIREMENTS
LATENCY SIGNAL SIGNAL STATE NO. OF RISING EDGES OF FREE RUNNING PCICLK 1 1 1 1 3ms 2 MAX
CPUSTOP
0 (DISABLED) 1 (ENABLED)
PCISTOP
0 (DISABLED) 1 (ENABLED)
PWRDWN
1 (NORMAL OPERATION) 0 (POWER DOWN)
NOTES: 1. Clock ON/OFF latency is defined as the number of rising edges of free running PCICLKs between the clock disable goes HIGH/LOW to the first valid clock that comes out of the device. 2. Power up latency is when PWRDWN goes inactive (HIGH) to when the first valid clocks are driven from the device.
1998 Sep 29
4
Philips Semiconductors
Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
ABSOLUTE MAXIMUM RATINGS1, 2
In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to VSS (VSS = 0V) SYMBOL VDD3 VDDQ3 VDDQ2 IIK VI IOK VO IO TSTG PTOT PARAMETER DC 3.3V core supply voltage DC 3.3V I/O supply voltage DC 2.5V I/O supply voltage DC input diode current DC input voltage DC output diode current DC output voltage DC output source or sink current Storage temperature range Power dissipation per package plastic medium-shrink (SSOP) For temperature range: -40 to +125C above +55C derate linearly with 11.3mW/K VI < 0 Note 2 VO > VCC or VO < 0 Note 2 VO >= 0 to VCC -65 -0.5 -0.5 CONDITION LIMITS MIN -0.5 -0.5 -0.5 MAX +4.6 +4.6 +3.6 -50 5.5 50 VCC + 0.5 50 +150 850 UNIT V V V mA V mA V mA C mW
NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
LIMITS SYMBOL VDD3 VDDQ3 VDDQ2 VI VO Tamb PARAMETER DC 3.3V core supply voltage DC 3.3V I/O supply voltage DC 2.5V I/O supply voltage DC input voltage range DC output voltage range Operating ambient temperature range in free air CONDITIONS MIN Note 1 Note 2 Note 3 3.135 3.135 2.135 0 0 0 MAX 3.465 3.465 2.625 VDD3 VDDQ2 VDDQ3 +70 V V V V V C UNIT
NOTES: 1. VDD3 = VDDCORE1 = VDDCORE2 = 3.3V 2. VDDQ3 = VDDREF = VDDPCI0 = 3.3V 3. VDDQ2 = VDDCPU0 = VDDCPU1 = 2.5V
1998 Sep 29
5
Philips Semiconductors
Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
DC CHARACTERISTICS
TEST CONDITIONS SYMBOL PARAMETER VDD (V) VIH VIL VOH2 VOL2 VOH3 VOL3 VPOH VPOL IOH IOH IOL IOL II IOZ Cin Cxtal Cout Idd3 HIGH level input voltage LOW level input voltage 2.5V output HIGH voltage CPUCLK 2.5V output LOW voltage CPUCLK 3.3V output HIGH voltage REF 3.3V output LOW voltage REF PCI output HIGH voltage PCI output LOW voltage CPUCLK output HIGH current PCI output HIGH current CPUCLK output LOW current PCI output LOW current Input leakage current 3-State output OFF-State current Input pin capacitance Xtal pin capacitance, as seen by external crystal Output pin capacitance O erating su ly Operating supply current Powerdown supply current Idd2 O erating su ly Operating supply current Powerdown supply current 2.625 66MHz mode 3.465 100MHz mode 66MHz mode 100MHz mode Outputs loaded1 Outputs loaded1 Output loaded1 Output loaded1 18 6 170 170 500 72 100 100 3.135 to 3.465 3.135 to 3.465 2.375 to 2.625 2.375 to 2.625 3.135 to 3.465 3.135 to 3.465 3.135 to 3.465 3.135 to 3.465 2.375 2.625 3.135 3.465 2.375 2.625 3.135 3.465 3.465 3.465 VOUT = Vdd or GND IO = 0 IOH = -1mA IOL = 1mA IOH = -1mA IOL = 1mA IOH = -1mA IOL = 1mA VOUT = 1.0V VOUT = 2.375V VOUT = 1.0V VOUT = 3.135V VOUT = 1.2V VOUT = 0.3V VOUT = 1.95V VOUT = 0.4V OTHER VDDQ2 = 2.5V 5% VDDQ3 = 3.3V 5% VDDQ3 = 3.3V 5% LIMITS Tamb = 0C to +70C MIN 2.0 VSS - 0.3 2.0 - 2.0 - 2.4 - -27 - -33 - 27 - 30 - - - TYP MAX VDD + 0.3 0.8 - 0.4 - 0.4 - 0.55 - -27 - -33 - 30 - 38 5 10 5 V V V V V V V V mA mA mA mA A A pF pF pF mA mA A mA mA A UNIT
All static inputs to VDD or GND
All static inputs to VDD or GND
NOTE: 1. All clock outputs loaded with maximum lump capacitance test load specified in AC characteristics section.
1998 Sep 29
6
Philips Semiconductors
Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
AC CHARACTERISTICS
VDDREF = VDDPCI (0-1)= 3.3V 5%; VDDCPU = 2.5V 5%; fcrystal = 14.31818 MHz
CPU CLOCK OUTPUTS, CPU(0-3) (LUMP CAPACITANCE TEST LOAD = 20pF)
SYMBOL THKP (tP) THKH (tH) THKL (tL) THKP (tP) THKH (tH) THKL (tL) THRISE (tR) THFALL (tF) TJITTER (tJC) DUTY CYCLE (tD) THSKW (tSK) THSTB (fST) PARAMETER CPUCLK period CPUCLK HIGH time CPUCLK LOW time CPUCLK period CPUCLK HIGH time CPUCLK LOW time CPUCLK rise time CPUCLK fall time CPUCLK jitter Output Duty Cycle CPU Bus CLK skew CPUCLK stabilization from Power-up 1 2 7 45 100MHz 66MHz TEST CONDITIONS NOTES 2 1, 5 1, 5 2 1, 5 1, 5 9 9 LIMITS Tamb = 0C to +70C MIN 15.0 5.2 5.0 10.0 3.0 2.8 0.4 0.4 1.6 1.6 175 55 175 3 ns ns ps % ps ms 10.5 ns MAX 15.5 ns UNIT
PCI CLOCK OUTPUTS, PCI(1-5) AND PCI_F (LUMP CAPACITANCE TEST LOAD = 30pF)
SYMBOL TPKP (tP) TPKPS TPKH (tH) TPKL (tL) THRISE (tR) THFALL (tF) TPSKW (tSK) THPOFFSET (tO) TPSTB (fST) PARAMETER PCICLK period PCICLK period stability PCICLK HIGH time PCICLK LOW time PCICLK rise time PCICLK fall time PCI Bus CLK skew CPUCLK to PCICLK Offset PCICLK stabilization from Power-up TEST CONDITIONS NOTES 3 8 1 1 10 10 2 2, 4 7 1.5 12.0 12.0 0.5 0.5 2.0 2.0 500 4.0 3 LIMITS Tamb = 0C to +70C MIN 30.0 500 MAX ns ps ns ns ns ns ps ns ms UNIT
REF CLOCK OUTPUT (LUMP CAPACITANCE TEST LOAD = 20pF)
SYMBOL PARAMETER TEST CONDITIONS NOTES f THRISE (tR) THFALL (tF) DUTY CYCLE (tD) THSTB (fST) Frequency, Actual Output rise edge rate Output fall edge rate Duty Cycle Frequency stabilization from Power-up (cold start) Frequency generated by Crystal 1 1 45 LIMITS Tamb = 0C to +70C MIN MAX MHz 4 4 55 3 ns ns % ms UNIT
14.31818
1998 Sep 29
7
Philips Semiconductors
Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
ALL CLOCK OUTPUTS
SYMBOL TPZL, TPZH TPLZ, TPHZ PARAMETER Output enable time Output disable time TEST CONDITIONS NOTES LIMITS Tamb = 0C to +70C MIN 1.0 1.0 MAX 8.0 8.0 ns ns UNIT
NOTES: 1. See Figure 3 for measure points. 2. Period, jitter, offset, and skew are measured on the rising edge @ 1.25V for 2.5V clocks and @ 1.5V for 3.3V clocks. 3. The PCICLK is the CPUCLK divided by two at CPUCLK = 66.6MHz. PCICLK is the CPUCLK divided by three at CPUCLK = 100MHz. 4. The CPUCLK must always lead the PCICLK as shown in Figure 2. 5. THKH is measured @ 2.0V as shown in Figure 4. 6. THKL is measured @ 0.4V as shown in Figure 4. 7. The time is specified from when VDDQ achieves its nominal operating level (typical condition is VDDQ = 3.3V) until the frequency output is stable and operating within specification. 8. Defined as once the clock is at its nominal operating frequency, the adjacent period changes cannot exceed the time specified. 9. THRISE and THFALL are measured as a transition through the threshold region VOL = 0.4V and VOH = 2.0V (1mA) JEDEC specification. 10. THRISE and THFALL (REF, PCI) are measured as a transition through the threshold region VOL = 0.4V and VOH = 2.4V
AC WAVEFORMS
VM = 1.25V @ VDDQ2 and 1.5V @ VDDQ3 VX = VOL + 0.3V VY = VOH -0.3V VOL and VOH are the typical output voltage drop that occur with the output load.
VDDQ2 1.25V CPUCLK VSS
2.5V CLOCKING INTERFACE 2.0 1.25 0.4
THKP DUTY CYCLE THKH
VDDQ2 1.25V CPUCLK VSS TPKH THSKW
3.3V CLOCKING INTERFACE (TTL) 2.4 1.5 0.4
THKL TRISE TFALL TPKP
SW00240
Figure 1. CPUCLK to CPUCLK skew
TRISE TFALL
TPKL
SW00242
VDDQ2 1.25V CPUCLK VSS
Figure 3. 2.5V/3.3V Clock waveforms
VDDQ3 1.5V PCICLK VSS
THPOFFSET
SW00241
Figure 2. CPUCLK to PCICLK offset
1998 Sep 29
8
Philips Semiconductors
Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
VI SEL 100, 66, SEL1, SEL0 GND VM
COMPONENT MEASUREMENT POINTS 2.5VOLT MEASURE POINTS
VOH = 2.0V tPLZ tPZL
VDDQ2 VIH = 1.7V 1.25V VIL = 0.7V
SYSTEM MEASUREMENT POINTS
VOL = 0.4V VSS VM
VDD OUTPUT LOW-to-OFF OFF-to-LOW VX VOL tPHZ VOH OUTPUT HIGH-to-OFF OFF-to-HIGH VSS outputs enabled VY VM tPZH
COMPONENT MEASUREMENT POINTS 3.3VOLT MEASURE POINTS
VOH = 2.4V
VOL = 0.4V VSS outputs enabled
VDDQ3 VIH = 2.0V 1.5V VIL = 0.7V
SYSTEM MEASUREMENT POINTS
outputs disabled
SW00243 SW00239
Figure 5. Component versus system measure points
Figure 4. 3-State enable and disable times.
1998 Sep 29
9
Philips Semiconductors
Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
CPUSTOP
CPUCLK (INTERNAL)
PCICLK (INTERNAL)
PCICLK (FREE-RUNNING)
CPUSTOP
CPUCLK (EXTERNAL)
PCISTOP
CPUCLK (INTERNAL)
PCICLK (INTERNAL)
PCICLK (FREE-RUNNING)
PCISTOP
PCICLK (EXTERNAL)
PWRDWN
CPUCLK (INTERNAL)
PCICLK (INTERNAL)
PWRDWN
CPUCLK (EXTERNAL)
PCICLK (EXTERNAL)
VCO
CRYSTAL
Figure 6. Power Management
1998 Sep 29
10
A A A A
SW00244
Philips Semiconductors
Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3mm
SOT341-1
1998 Sep 29
11
Philips Semiconductors
Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
Data sheet status
Data sheet status Objective specification Preliminary specification Product specification Product status Development Qualification Definition [1] This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Production
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088-3409 Telephone 800-234-7381 (c) Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. print code Document order number: Date of release: 05-96 9397-750-04604
Philips Semiconductors
yyyy mmm dd 12


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